Thermal resistance investigations on new leadframe-based LED packages and boards

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00205483" target="_blank" >RIV/68407700:21230/13:00205483 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.microrel.2013.02.016" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2013.02.016</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.microrel.2013.02.016" target="_blank" >10.1016/j.microrel.2013.02.016</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Thermal resistance investigations on new leadframe-based LED packages and boards

Popis výsledku v původním jazyce

In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board.

Název v anglickém jazyce

Thermal resistance investigations on new leadframe-based LED packages and boards

Popis výsledku anglicky

In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/7H10017" target="_blank" >7H10017: Consumerizing Solid State Lighting</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics Reliability

ISSN

0026-2714

e-ISSN

—

Svazek periodika

8

Číslo periodika v rámci svazku

53

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

11

Strana od-do

1084-1094

Kód UT WoS článku

000322292100006

EID výsledku v databázi Scopus

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