Thermal Analysis of LED Lamps for Optimal Driver Integration
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00230093" target="_blank" >RIV/68407700:21230/15:00230093 - isvavai.cz</a>
Výsledek na webu
<a href="http://apps.webofknowledge.com/full_record.do?product=UA&search_mode=OneClickSearch&qid=18&SID=Y1S9vTYUvsdkvfxZKdj&page=1&doc=1" target="_blank" >http://apps.webofknowledge.com/full_record.do?product=UA&search_mode=OneClickSearch&qid=18&SID=Y1S9vTYUvsdkvfxZKdj&page=1&doc=1</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/TPEL.2014.2346543" target="_blank" >10.1109/TPEL.2014.2346543</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Thermal Analysis of LED Lamps for Optimal Driver Integration
Popis výsledku v původním jazyce
This paper studies the thermal influence of a light-emitting diode (LED) driver on a retrofit LED lamp, also reporting on a procedure for its thermal characterization and multiscale modeling. In this analysis, temperature is measured by infrared thermography and monitoring specific locations with thermocouples. Experimental results point out that temperature increases considerably in all lamp parts when the driver is installed in the lamp (up to 15% for LED board). The multiscale simulation approach is set with thermal parameters (thermal conductivity, emissivity, and LED board thermal resistance) measured from several parts of the lamp, reaching an agreement between experiment and simulation smaller than 10%. With this model, the driver temperature is investigated under operational conditions accounting for two alternative thermal designs.
Název v anglickém jazyce
Thermal Analysis of LED Lamps for Optimal Driver Integration
Popis výsledku anglicky
This paper studies the thermal influence of a light-emitting diode (LED) driver on a retrofit LED lamp, also reporting on a procedure for its thermal characterization and multiscale modeling. In this analysis, temperature is measured by infrared thermography and monitoring specific locations with thermocouples. Experimental results point out that temperature increases considerably in all lamp parts when the driver is installed in the lamp (up to 15% for LED board). The multiscale simulation approach is set with thermal parameters (thermal conductivity, emissivity, and LED board thermal resistance) measured from several parts of the lamp, reaching an agreement between experiment and simulation smaller than 10%. With this model, the driver temperature is investigated under operational conditions accounting for two alternative thermal designs.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2015
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
IEEE Transactions on Power Electronics
ISSN
0885-8993
e-ISSN
1941-0107
Svazek periodika
7
Číslo periodika v rámci svazku
30
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
16
Strana od-do
3876-3891
Kód UT WoS článku
000353126300038
EID výsledku v databázi Scopus
2-s2.0-84923873728