Thermal Management Strategies for Low- and High-Voltage Retrofit LED Lamp Drivers
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00324887" target="_blank" >RIV/68407700:21230/19:00324887 - isvavai.cz</a>
Výsledek na webu
<a href="http://hdl.handle.net/10467/87092" target="_blank" >http://hdl.handle.net/10467/87092</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/TPEL.2018.2853119" target="_blank" >10.1109/TPEL.2018.2853119</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Thermal Management Strategies for Low- and High-Voltage Retrofit LED Lamp Drivers
Popis výsledku v původním jazyce
Several thermal management strategies for LED drivers designed for high lumen retrofit LED lamps are studied by simulation and experimentation means. Depending on the driver output, two scenarios are analyzed: Low Voltage-High Current (18V-620mA) and High Voltage-Low Current (110V-85mA). Experiments (infrared thermography and thermocouples) and multiscale simulation approaches are used to assist both the lamp and driver board thermal design, as well as the driver proper integration in the lighting system. As a result, a heatsink based on an Aluminum hollow cylinder with polymer axial fins is designed and evaluated. The heatsink assessement is carried out with an LED board, in which the LED junction temperature is modeled and extracted by monitoring the LED board backside temperature. Additional experimentation to better integrate the driver is performed aiming at reducing the contact thermal resistance between the driver and the heatsink and improving the heat removal in the driver housing by including a material with a high thermal conductivity (i.e., dry silica sand or magnesium oxide powder). The proposed solution reduces the LED junction temperature up to 18% with respect to a reference lamp, whereas both drivers depict working temperatures around or below 125°C, when a working temperature of 90°C is considered.
Název v anglickém jazyce
Thermal Management Strategies for Low- and High-Voltage Retrofit LED Lamp Drivers
Popis výsledku anglicky
Several thermal management strategies for LED drivers designed for high lumen retrofit LED lamps are studied by simulation and experimentation means. Depending on the driver output, two scenarios are analyzed: Low Voltage-High Current (18V-620mA) and High Voltage-Low Current (110V-85mA). Experiments (infrared thermography and thermocouples) and multiscale simulation approaches are used to assist both the lamp and driver board thermal design, as well as the driver proper integration in the lighting system. As a result, a heatsink based on an Aluminum hollow cylinder with polymer axial fins is designed and evaluated. The heatsink assessement is carried out with an LED board, in which the LED junction temperature is modeled and extracted by monitoring the LED board backside temperature. Additional experimentation to better integrate the driver is performed aiming at reducing the contact thermal resistance between the driver and the heatsink and improving the heat removal in the driver housing by including a material with a high thermal conductivity (i.e., dry silica sand or magnesium oxide powder). The proposed solution reduces the LED junction temperature up to 18% with respect to a reference lamp, whereas both drivers depict working temperatures around or below 125°C, when a working temperature of 90°C is considered.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2019
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
IEEE Transactions on Power Electronics
ISSN
0885-8993
e-ISSN
1941-0107
Svazek periodika
34
Číslo periodika v rámci svazku
4
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
12
Strana od-do
3677-3688
Kód UT WoS článku
000461254000058
EID výsledku v databázi Scopus
2-s2.0-85049438382