Determination of BGA solder joint detachment cause - warpage effect

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00233831" target="_blank" >RIV/68407700:21230/15:00233831 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21220/15:00233831

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2015.7248011" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7248011</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7248011" target="_blank" >10.1109/ISSE.2015.7248011</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Determination of BGA solder joint detachment cause - warpage effect

Popis výsledku v původním jazyce

Many aspects such as different materials used during the electronic assembly, increasingly finer dimensions of components, different processes and their settings have an influence on reliability of electronics products. This article deals with BGA assembly, specifically the determination of BGA solder joint detachment cause - with a warpage effect. Samples for diagnostic were obtained from manufacturer, who already pointed to the probable problematic location (BGA component) by electric in-circuit test.Cross-section of BGA assembly was made and an open joint - thin longitudinal gap between BGA component and solder joints connection was observed. The task was to identify a cause that produced axial detachment of BGA solder ball from component pads. Theuse of Scanning Electron Microscopy (SEM) determined that detachment was caused by a warpage effect.

Název v anglickém jazyce

Determination of BGA solder joint detachment cause - warpage effect

Popis výsledku anglicky

Many aspects such as different materials used during the electronic assembly, increasingly finer dimensions of components, different processes and their settings have an influence on reliability of electronics products. This article deals with BGA assembly, specifically the determination of BGA solder joint detachment cause - with a warpage effect. Samples for diagnostic were obtained from manufacturer, who already pointed to the probable problematic location (BGA component) by electric in-circuit test.Cross-section of BGA assembly was made and an open joint - thin longitudinal gap between BGA component and solder joints connection was observed. The task was to identify a cause that produced axial detachment of BGA solder ball from component pads. Theuse of Scanning Electron Microscopy (SEM) determined that detachment was caused by a warpage effect.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

38th International Spring Seminar on Electronics Technology (ISSE 2015)

ISBN

978-1-4799-8860-0

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

306-309

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Eger

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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