Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00233980" target="_blank" >RIV/68407700:21230/16:00233980 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.microrel.2015.10.020" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2015.10.020</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.microrel.2015.10.020" target="_blank" >10.1016/j.microrel.2015.10.020</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

Popis výsledku v původním jazyce

Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed though they would have worked normally. Since it is not possible to export such marked products, the total production quality decreases. In this work, we analyze the real manufacturing problem using Energy Dispersive Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis of potential source of residues together with its diagnostic and confirmation of its source is presented in this work.

Název v anglickém jazyce

Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

Popis výsledku anglicky

Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed though they would have worked normally. Since it is not possible to export such marked products, the total production quality decreases. In this work, we analyze the real manufacturing problem using Energy Dispersive Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis of potential source of residues together with its diagnostic and confirmation of its source is presented in this work.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics Reliability

ISSN

0026-2714

e-ISSN

—

Svazek periodika

56

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

162-169

Kód UT WoS článku

000369450200025

EID výsledku v databázi Scopus

2-s2.0-84954072008