Flux effect on void quantity and size in soldered joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00301367" target="_blank" >RIV/68407700:21230/16:00301367 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/00216305:26220/16:PU122004

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.microrel.2016.03.009" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2016.03.009</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.microrel.2016.03.009" target="_blank" >10.1016/j.microrel.2016.03.009</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Flux effect on void quantity and size in soldered joints

Popis výsledku v původním jazyce

This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.

Název v anglickém jazyce

Flux effect on void quantity and size in soldered joints

Popis výsledku anglicky

This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrence.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics Reliability

ISSN

0026-2714

e-ISSN

—

Svazek periodika

60

Číslo periodika v rámci svazku

5

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

6

Strana od-do

135-140

Kód UT WoS článku

000375516200019

EID výsledku v databázi Scopus

2-s2.0-84977914382