Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376586" target="_blank" >RIV/68407700:21230/24:00376586 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1007/s40194-024-01824-3" target="_blank" >https://doi.org/10.1007/s40194-024-01824-3</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s40194-024-01824-3" target="_blank" >10.1007/s40194-024-01824-3</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

Popis výsledku v původním jazyce

Due to electronics miniaturization, the size of voids is becoming comparable to that of solder joints, thereby increasing the risk of reduced reliability. This work presents a novel method of achieving void reduction through preliminary characterization of the flux and, consequently, the proper flux selection and adjustment of the temperature profile during soldering. To validate this approach, five SAC305 solder pastes differing in flux composition were subjected to testing. The flux components were characterized by a gas chromatograph combined with a mass spectrometer (GC–MS) and thermogravimetric analysis (TGA). Subsequently, four temperature profiles differing in the heating rate were employed for reflow soldering of the test boards with components while maintaining the same peak temperature for all profiles. The results of the X-ray computed tomography (XCT) analysis indicated that as the temperature gradient decreased, the number of voids decreased by up to 36%. The decrease in the number of flux residues detected by TGA present at the peak process temperature was also accompanied by a decrease in the void area within the solder joint. Moreover, a comparison between the GC–MS and XCT results revealed that certain flux compounds, such as butylated hydroxytoluene, were found to have a greater impact on void formation than others. The proposed method combining flux characterization by GC–MS and TGA and adjustment of temperature gradient during the soldering process can be an efficient way to reduce voids in solder joints. Additionally, it appears that a lower temperature gradient is generally associated with a lower incidence of voids.

Název v anglickém jazyce

Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

Popis výsledku anglicky

Due to electronics miniaturization, the size of voids is becoming comparable to that of solder joints, thereby increasing the risk of reduced reliability. This work presents a novel method of achieving void reduction through preliminary characterization of the flux and, consequently, the proper flux selection and adjustment of the temperature profile during soldering. To validate this approach, five SAC305 solder pastes differing in flux composition were subjected to testing. The flux components were characterized by a gas chromatograph combined with a mass spectrometer (GC–MS) and thermogravimetric analysis (TGA). Subsequently, four temperature profiles differing in the heating rate were employed for reflow soldering of the test boards with components while maintaining the same peak temperature for all profiles. The results of the X-ray computed tomography (XCT) analysis indicated that as the temperature gradient decreased, the number of voids decreased by up to 36%. The decrease in the number of flux residues detected by TGA present at the peak process temperature was also accompanied by a decrease in the void area within the solder joint. Moreover, a comparison between the GC–MS and XCT results revealed that certain flux compounds, such as butylated hydroxytoluene, were found to have a greater impact on void formation than others. The proposed method combining flux characterization by GC–MS and TGA and adjustment of temperature gradient during the soldering process can be an efficient way to reduce voids in solder joints. Additionally, it appears that a lower temperature gradient is generally associated with a lower incidence of voids.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Welding in the World

ISSN

0043-2288

e-ISSN

1878-6669

Svazek periodika

68

Číslo periodika v rámci svazku

12

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

10

Strana od-do

3195-3204

Kód UT WoS článku

001291238100001

EID výsledku v databázi Scopus

2-s2.0-85201265283