Substrate influence on temperature distribution along the PCB during vapor phase soldering

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00303500" target="_blank" >RIV/68407700:21230/16:00303500 - isvavai.cz</a>

Výsledek na webu

<a href="http://80.ieeexplore.ieee.org.dialog.cvut.cz/document/7563203/" target="_blank" >http://80.ieeexplore.ieee.org.dialog.cvut.cz/document/7563203/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563203" target="_blank" >10.1109/ISSE.2016.7563203</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Substrate influence on temperature distribution along the PCB during vapor phase soldering

Popis výsledku v původním jazyce

This article is focused on measurement of temperature gradients in different locations on test-boards during Vapor Phase Soldering (VPS) with different materials as PCB substrates. VPS is usually applied in electronics assembly technologies due to its ability to heat the board fast and uniformly during reflow soldering. The heating rate differs significantly even on a moderate size PCB. The measurements were performed on different substrates, particularly on FR4, FR4 with aluminum core, ceramic, and polyimide flexible board samples. The temperature gradients were uniform with low heat capacity boards, contrary, the high heat capacity aluminum based PCB showed significant non-uniformity in heating, where observed temperature differences reached up to 20 °C.

Název v anglickém jazyce

Substrate influence on temperature distribution along the PCB during vapor phase soldering

Popis výsledku anglicky

This article is focused on measurement of temperature gradients in different locations on test-boards during Vapor Phase Soldering (VPS) with different materials as PCB substrates. VPS is usually applied in electronics assembly technologies due to its ability to heat the board fast and uniformly during reflow soldering. The heating rate differs significantly even on a moderate size PCB. The measurements were performed on different substrates, particularly on FR4, FR4 with aluminum core, ceramic, and polyimide flexible board samples. The temperature gradients were uniform with low heat capacity boards, contrary, the high heat capacity aluminum based PCB showed significant non-uniformity in heating, where observed temperature differences reached up to 20 °C.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-5090-1389-0

ISSN

2161-2528

e-ISSN

—

Počet stran výsledku

6

Strana od-do

267-272

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Plzeň

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800054