Investigating the effect of solder paste viscosity change on the pressure during stencil printing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306420" target="_blank" >RIV/68407700:21230/16:00306420 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/document/7777238/#full-text-section" target="_blank" >http://ieeexplore.ieee.org/document/7777238/#full-text-section</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/SIITME.2016.7777238" target="_blank" >10.1109/SIITME.2016.7777238</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Investigating the effect of solder paste viscosity change on the pressure during stencil printing

Popis výsledku v původním jazyce

The purpose of this article is to present our experiments with Vapour Phase Soldering, where the temperature distribution and heat transfer mechanisms were investigated on four test-boards with different substrates. We developed a method to measure the temperature gradients on- board inside an experimental vapour phase soldering oven. VP soldering process is suitable for consistent and rapid heating on boards from small scale to large ones with power components showing considerable thermal capacities. The measurements were performed on FR4, ceramic, alumina composite and flexible substrates, where the results show significant differences between the different materials, and point to investigations with thermal diffusivity for future research.

Název v anglickém jazyce

Investigating the effect of solder paste viscosity change on the pressure during stencil printing

Popis výsledku anglicky

The purpose of this article is to present our experiments with Vapour Phase Soldering, where the temperature distribution and heat transfer mechanisms were investigated on four test-boards with different substrates. We developed a method to measure the temperature gradients on- board inside an experimental vapour phase soldering oven. VP soldering process is suitable for consistent and rapid heating on boards from small scale to large ones with power components showing considerable thermal capacities. The measurements were performed on FR4, ceramic, alumina composite and flexible substrates, where the results show significant differences between the different materials, and point to investigations with thermal diffusivity for future research.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

ISBN

978-1-5090-4446-7

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

36-39

Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Oradea

Datum konání akce

20. 10. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000390557400003