Corrosion-induced tin whisker growth in electronic devices: a review

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00317631" target="_blank" >RIV/68407700:21230/17:00317631 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1108/SSMT-10-2016-0023" target="_blank" >http://dx.doi.org/10.1108/SSMT-10-2016-0023</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-10-2016-0023" target="_blank" >10.1108/SSMT-10-2016-0023</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Corrosion-induced tin whisker growth in electronic devices: a review

Popis výsledku v původním jazyce

Purpose - The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks. Design/methodology/approach - The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field. Findings - The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field. Practical implications-This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation Originality/value - The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

Název v anglickém jazyce

Corrosion-induced tin whisker growth in electronic devices: a review

Popis výsledku anglicky

Purpose - The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks. Design/methodology/approach - The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field. Findings - The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field. Practical implications-This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation Originality/value - The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Soldering & Surface Mount Technology

ISSN

0954-0911

e-ISSN

1758-6836

Svazek periodika

29

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

10

Strana od-do

59-68

Kód UT WoS článku

000396464600011

EID výsledku v databázi Scopus

2-s2.0-85011024396