Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00334199" target="_blank" >RIV/68407700:21230/19:00334199 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.13164/re.2019.0598" target="_blank" >https://doi.org/10.13164/re.2019.0598</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.13164/re.2019.0598" target="_blank" >10.13164/re.2019.0598</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance
Popis výsledku v původním jazyce
This article describes waffle power MOSFET segmentation and defines its analytic models. Although waffle gate pattern is well-known architecture for effective channel scaling without requirements on process modification, until today no precise model considering segmentation of MOSFETs with waffle gate patterns, due to bulk connections, has been proposed. Two different MOSFET topologies with gate waffle patterns have been investigated and compared with the same on-resistance of a standard MOSFET with finger gate pattern. The first one with diagonal metal interconnections allows reaching more than 40% area reduction. The second MOSFET with the simpler orthogonal metal interconnections allows saving more than 20% area. Moreover, new models defining conditions where segmented power MOSFETs with waffle gate patterns occupy less area than the standard MOSFET with finger gate pattern, have been introduced.
Název v anglickém jazyce
Comparison of MOSFET Gate Waffle Patterns Based on Specific On-Resistance
Popis výsledku anglicky
This article describes waffle power MOSFET segmentation and defines its analytic models. Although waffle gate pattern is well-known architecture for effective channel scaling without requirements on process modification, until today no precise model considering segmentation of MOSFETs with waffle gate patterns, due to bulk connections, has been proposed. Two different MOSFET topologies with gate waffle patterns have been investigated and compared with the same on-resistance of a standard MOSFET with finger gate pattern. The first one with diagonal metal interconnections allows reaching more than 40% area reduction. The second MOSFET with the simpler orthogonal metal interconnections allows saving more than 20% area. Moreover, new models defining conditions where segmented power MOSFETs with waffle gate patterns occupy less area than the standard MOSFET with finger gate pattern, have been introduced.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2019
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Radioengineering
ISSN
1210-2512
e-ISSN
—
Svazek periodika
28
Číslo periodika v rámci svazku
3
Stát vydavatele periodika
CZ - Česká republika
Počet stran výsledku
12
Strana od-do
598-609
Kód UT WoS článku
000485877700015
EID výsledku v databázi Scopus
2-s2.0-85076701209