Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350915" target="_blank" >RIV/68407700:21230/21:00350915 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE51996.2021.9467640" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467640</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467640" target="_blank" >10.1109/ISSE51996.2021.9467640</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin

Popis výsledku v původním jazyce

The objective of this work is to examine the mechanical and thermal properties of novel lead-free bismuth-tin solder alloys with low melting temperature, each with a different percentage of added gallium and with phosphorus as a trace element. The motivation was to determine solder alloy with decreased melting point and maintain mechanical properties of eutectic bismuth-tin solder alloy at the same time. BiSn40, BiSn40P, BiSn40Ga1, BiSn40Ga1P, BiSn40Ga3, and BiSn40Ga3P were among the analyzed solder alloys. In addition, the same properties of BiSn42 were analyzed for comparison as a reference. The thermal properties were examined by differential thermal analysis, where the melting and solidification points were determined. The Vickers micro-hardness test was conducted for the observation of mechanical attributes. Moreover, the microstructure of the alloys was observed in a scanning electron microscope. The result of this study showed that the temperature of the melting point significantly decreased in the alloy BiSn40Ga3. Also, this alloy seems to have as sufficient mechanical properties as BiSn42. Therefore, it could possibly be used as a suitable substitution for the eutectic solder alloy.

Název v anglickém jazyce

Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin

Popis výsledku anglicky

The objective of this work is to examine the mechanical and thermal properties of novel lead-free bismuth-tin solder alloys with low melting temperature, each with a different percentage of added gallium and with phosphorus as a trace element. The motivation was to determine solder alloy with decreased melting point and maintain mechanical properties of eutectic bismuth-tin solder alloy at the same time. BiSn40, BiSn40P, BiSn40Ga1, BiSn40Ga1P, BiSn40Ga3, and BiSn40Ga3P were among the analyzed solder alloys. In addition, the same properties of BiSn42 were analyzed for comparison as a reference. The thermal properties were examined by differential thermal analysis, where the melting and solidification points were determined. The Vickers micro-hardness test was conducted for the observation of mechanical attributes. Moreover, the microstructure of the alloys was observed in a scanning electron microscope. The result of this study showed that the temperature of the melting point significantly decreased in the alloy BiSn40Ga3. Also, this alloy seems to have as sufficient mechanical properties as BiSn42. Therefore, it could possibly be used as a suitable substitution for the eutectic solder alloy.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-1477-7

ISSN

—

e-ISSN

2161-2528

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Bautzen

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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