Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00354674" target="_blank" >RIV/68407700:21230/21:00354674 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.2139/ssrn.3972769" target="_blank" >https://doi.org/10.2139/ssrn.3972769</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.2139/ssrn.3972769" target="_blank" >10.2139/ssrn.3972769</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Popis výsledku v původním jazyce

In this paper, the effect of different thermocouple constructions are investigated from the aspect of reflow soldering, to achieve more precise soldering profile acquisition and failure analysis at different soldering heat transfer methods. The paper focuses on convection-based reflow and vapour phase soldering processes and related heat transfer coefficients. Different thermocouple constructions were investigated. The parameters involve ASTM-type (K, T, J), length of uninsulated wire length, insulation material (PFA, PVC, PTFE, woven glass-fibre), insulation thickness and dimensions of the hot-spot. The physical dimensions were obtained with optical microscopy for validation. Finite element analysis with multiphysics modelling (convection- and condensation-based heat transfer, and heat conduction in solids) was applied. After validation, the results show that most parameter and geometry changes – most significantly the uninsulated wire end – can result in non-negligible timely differences in 100 ms range between different sensors, pointing to the requirement of sorting and pairing in symmetric measurement environment. The results can be applied in modern manufacturing environment and in future process modelling and evaluation tasks.

Název v anglickém jazyce

Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Popis výsledku anglicky

In this paper, the effect of different thermocouple constructions are investigated from the aspect of reflow soldering, to achieve more precise soldering profile acquisition and failure analysis at different soldering heat transfer methods. The paper focuses on convection-based reflow and vapour phase soldering processes and related heat transfer coefficients. Different thermocouple constructions were investigated. The parameters involve ASTM-type (K, T, J), length of uninsulated wire length, insulation material (PFA, PVC, PTFE, woven glass-fibre), insulation thickness and dimensions of the hot-spot. The physical dimensions were obtained with optical microscopy for validation. Finite element analysis with multiphysics modelling (convection- and condensation-based heat transfer, and heat conduction in solids) was applied. After validation, the results show that most parameter and geometry changes – most significantly the uninsulated wire end – can result in non-negligible timely differences in 100 ms range between different sensors, pointing to the requirement of sorting and pairing in symmetric measurement environment. The results can be applied in modern manufacturing environment and in future process modelling and evaluation tasks.

Druh

J_ost - Ostatní články v recenzovaných periodicích

CEP obor

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OECD FORD obor

20205 - Automation and control systems

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

SSRN

ISSN

1556-5068

e-ISSN

—

Svazek periodika

—

Číslo periodika v rámci svazku

Nov 27

Stát vydavatele periodika

BE - Belgické království

Počet stran výsledku

15

Strana od-do

1-15

Kód UT WoS článku

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EID výsledku v databázi Scopus

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