Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00359654" target="_blank" >RIV/68407700:21230/22:00359654 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.csite.2022.102001" target="_blank" >https://doi.org/10.1016/j.csite.2022.102001</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.csite.2022.102001" target="_blank" >10.1016/j.csite.2022.102001</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Popis výsledku v původním jazyce

In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat transfer methods. The paper focuses on convection-based reflow and condensation based vapour phase soldering processes and related heat transfer coefficients. Different thermocouple constructions were investigated. The parameters include the ASTM-type (K, T, J), the length of uninsulated wire length, the insulation material (PFA, PVC, PTFE, woven glass-fibre), the insulation thickness and the diameter of the hot-spot. The physical dimensions were obtained with optical microscopy for validation. Finite element analysis was performed. After validation, the results show that most parameter and geometry changes - most significantly, the uninsulated wire end - can result in non-negligible timely differences in 100 ms range between different sensors, pointing to the requirement of sorting and pairing in a symmetric measurement environment. The results can be applied in a modern manufacturing environment and in future process modelling and evaluation tasks.

Název v anglickém jazyce

Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment

Popis výsledku anglicky

In this paper, the effect of different thermocouple constructions on the hot spot temperature are investigated with a modelling approach to achieve more precise soldering profile acquisition and failure analysis at different reflow soldering heat transfer methods. The paper focuses on convection-based reflow and condensation based vapour phase soldering processes and related heat transfer coefficients. Different thermocouple constructions were investigated. The parameters include the ASTM-type (K, T, J), the length of uninsulated wire length, the insulation material (PFA, PVC, PTFE, woven glass-fibre), the insulation thickness and the diameter of the hot-spot. The physical dimensions were obtained with optical microscopy for validation. Finite element analysis was performed. After validation, the results show that most parameter and geometry changes - most significantly, the uninsulated wire end - can result in non-negligible timely differences in 100 ms range between different sensors, pointing to the requirement of sorting and pairing in a symmetric measurement environment. The results can be applied in a modern manufacturing environment and in future process modelling and evaluation tasks.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Case Studies in Thermal Engineering

ISSN

2214-157X

e-ISSN

2214-157X

Svazek periodika

33

Číslo periodika v rámci svazku

102001

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

12

Strana od-do

1-12

Kód UT WoS článku

000797202600001

EID výsledku v databázi Scopus

2-s2.0-85128774697