Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00354608" target="_blank" >RIV/68407700:21230/22:00354608 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.3390/met12010121" target="_blank" >https://doi.org/10.3390/met12010121</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/met12010121" target="_blank" >10.3390/met12010121</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders

Popis výsledku v původním jazyce

Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been developed which need proper characterization. The following study looks at the behavior of four different Sn–Bi alloys—traditional 42Sn58Bi and 42Sn57Bi1Ag and two new tin–bismuth alloys—in solder paste during the reflow soldering process. Each alloy was processed using different reflow profiles that had varying times above liquidus (TALs) and peak temperatures. The PCBs were then analyzed to see how the processing variables influenced wetting, voiding, microstructure, intermetallic layer composition, and thickness. After analysis, the PCBs were then subjected to thermal cycling experiments to see how reflow profile impacted microstructure evolution. The results demonstrated that reflow profile affects properties such as metal wetting and voiding. It does not however, greatly impact key metallurgical properties such as intermetallic layer thickness.

Název v anglickém jazyce

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders

Popis výsledku anglicky

Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been developed which need proper characterization. The following study looks at the behavior of four different Sn–Bi alloys—traditional 42Sn58Bi and 42Sn57Bi1Ag and two new tin–bismuth alloys—in solder paste during the reflow soldering process. Each alloy was processed using different reflow profiles that had varying times above liquidus (TALs) and peak temperatures. The PCBs were then analyzed to see how the processing variables influenced wetting, voiding, microstructure, intermetallic layer composition, and thickness. After analysis, the PCBs were then subjected to thermal cycling experiments to see how reflow profile impacted microstructure evolution. The results demonstrated that reflow profile affects properties such as metal wetting and voiding. It does not however, greatly impact key metallurgical properties such as intermetallic layer thickness.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Metals — Open Access Metallurgy Journal

ISSN

2075-4701

e-ISSN

2075-4701

Svazek periodika

12

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

22

Strana od-do

—

Kód UT WoS článku

000757552300001

EID výsledku v databázi Scopus

2-s2.0-85122382342