Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00357884" target="_blank" >RIV/68407700:21230/22:00357884 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/TCPMT.2022.3160102" target="_blank" >https://doi.org/10.1109/TCPMT.2022.3160102</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/TCPMT.2022.3160102" target="_blank" >10.1109/TCPMT.2022.3160102</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices

Popis výsledku v původním jazyce

A new concept for encapsulation of discrete bipolar high-power devices using Epoxy Mold Compound is demonstrated on silicon 4.5 kV press-pack fast recovery diodes with wafer diameter up to 130 mm and molybdenum pressure-release buffer up to 140 mm in diameter. The silicon wafers can be bonded to molybdenum disks using low-temperature bonding process or they can be fixed mechanically by the epoxy mold compound without direct bonding (free-floating). The encapsulated devices can be applied as housing-less or they can be inserted into hermetic ceramic housings with pole piece of 143 mm. The design aspects relevant for reliable operation are presented using multi-physics simulation in COMSOL. The summary of passed reliability tests including electrical testing in true application conditions demonstrates readiness of the concept for demanding applications in the temperature range up to 140 °C.

Název v anglickém jazyce

Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices

Popis výsledku anglicky

A new concept for encapsulation of discrete bipolar high-power devices using Epoxy Mold Compound is demonstrated on silicon 4.5 kV press-pack fast recovery diodes with wafer diameter up to 130 mm and molybdenum pressure-release buffer up to 140 mm in diameter. The silicon wafers can be bonded to molybdenum disks using low-temperature bonding process or they can be fixed mechanically by the epoxy mold compound without direct bonding (free-floating). The encapsulated devices can be applied as housing-less or they can be inserted into hermetic ceramic housings with pole piece of 143 mm. The design aspects relevant for reliable operation are presented using multi-physics simulation in COMSOL. The summary of passed reliability tests including electrical testing in true application conditions demonstrates readiness of the concept for demanding applications in the temperature range up to 140 °C.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN

2156-3950

e-ISSN

2156-3985

Svazek periodika

12

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

8

Strana od-do

602-609

Kód UT WoS článku

000803110300007

EID výsledku v databázi Scopus

2-s2.0-85126552994