Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00360459" target="_blank" >RIV/68407700:21230/22:00360459 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.jmrt.2022.08.172" target="_blank" >https://doi.org/10.1016/j.jmrt.2022.08.172</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jmrt.2022.08.172" target="_blank" >10.1016/j.jmrt.2022.08.172</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Popis výsledku v původním jazyce

The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resis-tance of 99Sn0.3Ag0.7Cu-TiO2/ZnO (0.25wt%) composite solder alloys in a corrosive envi-ronment via scanning electron microscopy and focused ion beam techniques. The corrosive environment test showed that the application of TiO2 and ZnO nano-particles almost totally suppressed the Sn whisker growth and improved the corrosion resistance of the composite solder alloys compared to the reference 99Sn0.3Ag0.7Cu alloy. The microstructural analysis of the reference 99Sn0.3Ag0.7Cu solder alloy showed that the volumetric increase of the corroded b-Sn grains resulted in local mechanical stress in the solder joints, which was released by Sn whisker development. However, in the composite solder joints, the increased grain boundary fraction and segregation of the TiO2 and ZnO nano-particles to the grain boundaries resulted in a relatively uniform and compact pro-tective oxide layer at the b-Sn grain boundaries. This suppressed the formation of SnOx, and via this, the corrosion-induced whisker growth.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Název v anglickém jazyce

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Popis výsledku anglicky

The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resis-tance of 99Sn0.3Ag0.7Cu-TiO2/ZnO (0.25wt%) composite solder alloys in a corrosive envi-ronment via scanning electron microscopy and focused ion beam techniques. The corrosive environment test showed that the application of TiO2 and ZnO nano-particles almost totally suppressed the Sn whisker growth and improved the corrosion resistance of the composite solder alloys compared to the reference 99Sn0.3Ag0.7Cu alloy. The microstructural analysis of the reference 99Sn0.3Ag0.7Cu solder alloy showed that the volumetric increase of the corroded b-Sn grains resulted in local mechanical stress in the solder joints, which was released by Sn whisker development. However, in the composite solder joints, the increased grain boundary fraction and segregation of the TiO2 and ZnO nano-particles to the grain boundaries resulted in a relatively uniform and compact pro-tective oxide layer at the b-Sn grain boundaries. This suppressed the formation of SnOx, and via this, the corrosion-induced whisker growth.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Research and Technology

ISSN

2238-7854

e-ISSN

2214-0697

Svazek periodika

20

Číslo periodika v rámci svazku

09-10

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

10

Strana od-do

4231-4240

Kód UT WoS článku

000862508700007

EID výsledku v databázi Scopus

2-s2.0-85144727881