Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00367081" target="_blank" >RIV/68407700:21230/23:00367081 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.ceramint.2023.04.216" target="_blank" >https://doi.org/10.1016/j.ceramint.2023.04.216</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.ceramint.2023.04.216" target="_blank" >10.1016/j.ceramint.2023.04.216</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study

Popis výsledku v původním jazyce

This work studied the incorporation mechanism of TiO2 nano-particles into SnAgCu solders and their effect on the corrosion behavior of the composite alloy. Composite solder alloys have been made from 99Sn0.3Ag0.7Cu solder alloy and TiO2 nano-particles between 0.25 and 1 wt%. The alloys in solder joints were exposed to 4000 h long 85 degrees C/85RH% thermal-humidity test, and their surface was observed by SEM and FIB techniques. Large localized corrosion spots and numerous Sn whiskers have been found on the samples, except for the samples with 0.25 wt% TiO2 content. The corrosion of the Sn grains resulted in a volumetric increase and mechanical stress, which was relaxed via whisker growth. TiO2 nano-particles in 0.25 wt% incorporated layer-like at the boundaries of the Sn grain. Density functional theory calculations proved that at soldering conditions, the Sn atoms of the solder alloy could bond to the TiO2 NPs through the O atoms of TiO2. The TiO2-Sn oxide layer at the grain boundaries could suppress the corrosion of the composite solder alloys and whisker growth. In the case of higher weight fractions TiO2, the nano-particles were agglomerated and could not perform corrosion protection effect.

Název v anglickém jazyce

Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study

Popis výsledku anglicky

This work studied the incorporation mechanism of TiO2 nano-particles into SnAgCu solders and their effect on the corrosion behavior of the composite alloy. Composite solder alloys have been made from 99Sn0.3Ag0.7Cu solder alloy and TiO2 nano-particles between 0.25 and 1 wt%. The alloys in solder joints were exposed to 4000 h long 85 degrees C/85RH% thermal-humidity test, and their surface was observed by SEM and FIB techniques. Large localized corrosion spots and numerous Sn whiskers have been found on the samples, except for the samples with 0.25 wt% TiO2 content. The corrosion of the Sn grains resulted in a volumetric increase and mechanical stress, which was relaxed via whisker growth. TiO2 nano-particles in 0.25 wt% incorporated layer-like at the boundaries of the Sn grain. Density functional theory calculations proved that at soldering conditions, the Sn atoms of the solder alloy could bond to the TiO2 NPs through the O atoms of TiO2. The TiO2-Sn oxide layer at the grain boundaries could suppress the corrosion of the composite solder alloys and whisker growth. In the case of higher weight fractions TiO2, the nano-particles were agglomerated and could not perform corrosion protection effect.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Ceramics International

ISSN

0272-8842

e-ISSN

1873-3956

Svazek periodika

49

Číslo periodika v rámci svazku

14

Stát vydavatele periodika

IT - Italská republika

Počet stran výsledku

10

Strana od-do

23765-23774

Kód UT WoS článku

001020355900001

EID výsledku v databázi Scopus

2-s2.0-85153857463