Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00378858" target="_blank" >RIV/68407700:21230/24:00378858 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.scriptamat.2024.115987" target="_blank" >https://doi.org/10.1016/j.scriptamat.2024.115987</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.scriptamat.2024.115987" target="_blank" >10.1016/j.scriptamat.2024.115987</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study

Popis výsledku v původním jazyce

Ceramic nano-particles are frequently used as reinforcements in SAC alloys to improve their mechanical properties; however, the nano-particle dispersion and incorporation mechanisms are not well known. Composite SAC alloys were prepared from Sn99Ag0.3Cu0.7 alloy with TiO2 and SiC nano-particles in 0.5wt%. Solder joints were prepared by SMT technology between two Cu plates with 150 mu m thickness. SIMS was used to determine the nano-particle distribution along the solder joints' vertical cross-section. DFT calculations were done to investigate the possible interaction between the different nano-particles and the Sn atoms. SIMS results showed that the distribution of the nano-particles is inhomogeneous in the solder bulk; furthermore, the density characteristics highly depend on the size and shape of the nano-particles. DFT calculations proved that the non-soluble TiO2 and SiC could form chemical bonds with the Sn during the soldering, which might further explain their positive effect on the physical properties of composite SAC alloys.

Název v anglickém jazyce

Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study

Popis výsledku anglicky

Ceramic nano-particles are frequently used as reinforcements in SAC alloys to improve their mechanical properties; however, the nano-particle dispersion and incorporation mechanisms are not well known. Composite SAC alloys were prepared from Sn99Ag0.3Cu0.7 alloy with TiO2 and SiC nano-particles in 0.5wt%. Solder joints were prepared by SMT technology between two Cu plates with 150 mu m thickness. SIMS was used to determine the nano-particle distribution along the solder joints' vertical cross-section. DFT calculations were done to investigate the possible interaction between the different nano-particles and the Sn atoms. SIMS results showed that the distribution of the nano-particles is inhomogeneous in the solder bulk; furthermore, the density characteristics highly depend on the size and shape of the nano-particles. DFT calculations proved that the non-soluble TiO2 and SiC could form chemical bonds with the Sn during the soldering, which might further explain their positive effect on the physical properties of composite SAC alloys.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Scripta Materialia

ISSN

1359-6462

e-ISSN

1872-8456

Svazek periodika

243

Číslo periodika v rámci svazku

115987

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

6

Strana od-do

—

Kód UT WoS článku

001162493000001

EID výsledku v databázi Scopus

2-s2.0-85182608738