Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00371942" target="_blank" >RIV/68407700:21230/23:00371942 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE57496.2023.10168360" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168360</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168360" target="_blank" >10.1109/ISSE57496.2023.10168360</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives

Popis výsledku v původním jazyce

The temperature dependence of the resistance of adhesive conductive joints and the thermal coefficient of longitudinal expansion of conductive adhesives were examined. . The adhesive was applied by stencil printing. The resistance of the joints was measured by the four-point method and the thermal expansion of used adhesives was measured by the thermomechanical analysis technique. The junction resistance was found to increase approximately linearly with temperature. . It was also found that the coefficient of thermal longitudinal expansion varies depending on the adhesive and also on the sample when all samples are made from the same adhesive.

Název v anglickém jazyce

Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives

Popis výsledku anglicky

The temperature dependence of the resistance of adhesive conductive joints and the thermal coefficient of longitudinal expansion of conductive adhesives were examined. . The adhesive was applied by stencil printing. The resistance of the joints was measured by the four-point method and the thermal expansion of used adhesives was measured by the thermomechanical analysis technique. The junction resistance was found to increase approximately linearly with temperature. . It was also found that the coefficient of thermal longitudinal expansion varies depending on the adhesive and also on the sample when all samples are made from the same adhesive.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2023 46th International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3503-3485-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Temešvár

Datum konání akce

10. 5. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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