Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00375670" target="_blank" >RIV/68407700:21230/24:00375670 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE61612.2024.10604211" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604211</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604211" target="_blank" >10.1109/ISSE61612.2024.10604211</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles

Popis výsledku v původním jazyce

The aim of this work was to evaluate the effect of 0.1 wt.% titanium dioxide nanoparticles (NPs) incorporated in low-temperature Bi58Sn42 solder paste on spreading behavior and mechanical and thermal properties. The spreading test was conducted on testing printed circuit boards with an Organic Solderability Preservative (OSP) surface protection of copper layer. Mechanical properties were evaluated by a shear strength test of 1206 resistors soldered on FR4 boards with OSP coating. Shear strength was also studied in dependence on accelerated thermal aging. The prepared test boards for the shear test were annealed in a climatic chamber at 85°C and 100°C for 1000 hours. Additionally, the solder alloys were subjected to Differential Scanning Calorimetry (DSC) to examine their thermal properties. The results showed a significant improvement in spreading when using solder paste with incorporated TiO2 NPs. Furthermore, TiO2 nanoparticles did not prominently deteriorate the thermal and mechanical properties.

Název v anglickém jazyce

Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles

Popis výsledku anglicky

The aim of this work was to evaluate the effect of 0.1 wt.% titanium dioxide nanoparticles (NPs) incorporated in low-temperature Bi58Sn42 solder paste on spreading behavior and mechanical and thermal properties. The spreading test was conducted on testing printed circuit boards with an Organic Solderability Preservative (OSP) surface protection of copper layer. Mechanical properties were evaluated by a shear strength test of 1206 resistors soldered on FR4 boards with OSP coating. Shear strength was also studied in dependence on accelerated thermal aging. The prepared test boards for the shear test were annealed in a climatic chamber at 85°C and 100°C for 1000 hours. Additionally, the solder alloys were subjected to Differential Scanning Calorimetry (DSC) to examine their thermal properties. The results showed a significant improvement in spreading when using solder paste with incorporated TiO2 NPs. Furthermore, TiO2 nanoparticles did not prominently deteriorate the thermal and mechanical properties.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 47th International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3503-8548-9

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Praha

Datum konání akce

15. 5. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001283808200086