An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376744" target="_blank" >RIV/68407700:21230/24:00376744 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1109/ISSE61612.2024.10604132" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604132</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604132" target="_blank" >10.1109/ISSE61612.2024.10604132</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing
Popis výsledku v původním jazyce
Two types of solder paste, where for each there were three production / expiry dates, were compared on a gas chromatography and evaluated in terms of their application using stencil printing on a copper substrate (OSP surface finish). The number, percentage, and number of macrovoids were evaluated and compared. Altogether, six solder paste samples were tested, for each solder paste, the voids were evaluated using X-ray spectroscopy on 14 pads with a 1206 pad size. Despite the results from the gas chromatography showed the effect of solder paste aging, the voiding of the pastes did not differ significantly and, on the contrary, the percentage representation of voids was the smallest with the oldest solder paste.
Název v anglickém jazyce
An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing
Popis výsledku anglicky
Two types of solder paste, where for each there were three production / expiry dates, were compared on a gas chromatography and evaluated in terms of their application using stencil printing on a copper substrate (OSP surface finish). The number, percentage, and number of macrovoids were evaluated and compared. Altogether, six solder paste samples were tested, for each solder paste, the voids were evaluated using X-ray spectroscopy on 14 pads with a 1206 pad size. Despite the results from the gas chromatography showed the effect of solder paste aging, the voiding of the pastes did not differ significantly and, on the contrary, the percentage representation of voids was the smallest with the oldest solder paste.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
—
Počet stran výsledku
4
Strana od-do
—
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Praha
Datum konání akce
15. 5. 2024
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
001283808200071