Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00377082" target="_blank" >RIV/68407700:21230/24:00377082 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1109/ISSE61612.2024.10604022" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604022</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604022" target="_blank" >10.1109/ISSE61612.2024.10604022</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys
Popis výsledku v původním jazyce
This research aimed to investigate the susceptibility of Sn-58Bi alloys to Electrochemical Migration (ECM) when combined with TiO2 nanoparticles tested in various solutions, including deionized water (DI), 1 mM Na2SO4, 500 mM Na2SO4, 1 mM NaCl, and 500 mM NaCl, using water drop (WD) test. The results revealed a heightened ECM susceptibility in Sn-58Bi alloys with the addition of TiO2 nanoparticles, indicating an adverse impact of TiO2 nanoparticle incorporation. Furthermore, scanning electron microscopy and energy dispersive X-ray spectroscopy (SEMEDS) were utilized to analyze the surface morphology and elemental composition of dendrites formed after the WD tests. The outcomes showed the presence of dendrites and precipitates in both Sn-58Bi and Sn-58Bi-0.1% TiO2 cases. Sn was identified as the primary element in the dendrites, while Bi was not detected in the dendrites in any of the cases. Consequently, the reliability of electronics may be compromised when using Bi-Sn paste doped with TiO2 nanoparticles, particularly in terms of ECM. Nonetheless, these nanoparticles could enhance other properties associated with modified microstructure, such as mechanical or thermal properties, which warrant further investigation.
Název v anglickém jazyce
Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys
Popis výsledku anglicky
This research aimed to investigate the susceptibility of Sn-58Bi alloys to Electrochemical Migration (ECM) when combined with TiO2 nanoparticles tested in various solutions, including deionized water (DI), 1 mM Na2SO4, 500 mM Na2SO4, 1 mM NaCl, and 500 mM NaCl, using water drop (WD) test. The results revealed a heightened ECM susceptibility in Sn-58Bi alloys with the addition of TiO2 nanoparticles, indicating an adverse impact of TiO2 nanoparticle incorporation. Furthermore, scanning electron microscopy and energy dispersive X-ray spectroscopy (SEMEDS) were utilized to analyze the surface morphology and elemental composition of dendrites formed after the WD tests. The outcomes showed the presence of dendrites and precipitates in both Sn-58Bi and Sn-58Bi-0.1% TiO2 cases. Sn was identified as the primary element in the dendrites, while Bi was not detected in the dendrites in any of the cases. Consequently, the reliability of electronics may be compromised when using Bi-Sn paste doped with TiO2 nanoparticles, particularly in terms of ECM. Nonetheless, these nanoparticles could enhance other properties associated with modified microstructure, such as mechanical or thermal properties, which warrant further investigation.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
—
Počet stran výsledku
6
Strana od-do
—
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Praha
Datum konání akce
15. 5. 2024
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
001283808200060