Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00367199" target="_blank" >RIV/68407700:21230/23:00367199 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE57496.2023.10168367" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168367</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168367" target="_blank" >10.1109/ISSE57496.2023.10168367</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

Popis výsledku v původním jazyce

This work aimed to investigate the susceptibility of novel nanocomposite solder paste to electrochemical migration (ECM). Bismuth-tin solder paste was filled with 0.1 wt.% of TiO2 nanoparticles. The electrochemical migration behavior was evaluated using a water drop (WD) test. High-purity water and 10 VDC bias voltage were applied. The experiments were performed on two types of samples differing in the surface finish of conductive pattern- bare copper without surface protection and copper with applied galvanic gold finish. The results revealed a trend when the mean time to failure decreased for samples with deposited nanocomposite solder paste, regardless of the surface finish. Thus, the electronics’ reliability may be lowered when using Bi-Sn paste doped with TiO2 nanoparticles, at least in terms of ECM. This deterioration of the solder paste should be considered a significant drawback for further development. However, the nanoparticles could improve other properties related to modified microstructure, such as mechanical or thermal. These aspects will be the subject of further research.

Název v anglickém jazyce

Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

Popis výsledku anglicky

This work aimed to investigate the susceptibility of novel nanocomposite solder paste to electrochemical migration (ECM). Bismuth-tin solder paste was filled with 0.1 wt.% of TiO2 nanoparticles. The electrochemical migration behavior was evaluated using a water drop (WD) test. High-purity water and 10 VDC bias voltage were applied. The experiments were performed on two types of samples differing in the surface finish of conductive pattern- bare copper without surface protection and copper with applied galvanic gold finish. The results revealed a trend when the mean time to failure decreased for samples with deposited nanocomposite solder paste, regardless of the surface finish. Thus, the electronics’ reliability may be lowered when using Bi-Sn paste doped with TiO2 nanoparticles, at least in terms of ECM. This deterioration of the solder paste should be considered a significant drawback for further development. However, the nanoparticles could improve other properties related to modified microstructure, such as mechanical or thermal. These aspects will be the subject of further research.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20501 - Materials engineering

Projekt

<a href="/cs/project/EF16_028%2F0006215" target="_blank" >EF16_028/0006215: Rozvoj kapacit pro strategické řízení výzkumu na ČVUT v Praze</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2023 46th International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3503-3484-5

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Temešvár

Datum konání akce

10. 5. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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