Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00340028" target="_blank" >RIV/68407700:21230/19:00340028 - isvavai.cz</a>

Výsledek na webu

<a href="http://hdl.handle.net/11025/36515" target="_blank" >http://hdl.handle.net/11025/36515</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

Popis výsledku v původním jazyce

In this article, the electrochemical migration of lead-free solders and electrically conductive adhesives with an Ag content of more than 70% was studied by using a water drop test in NaCl solution. The results of solder pastes were compared with the results of electrically conductive adhesives. It was found that some solder pastes with a low Ag content have a lower susceptibility to electrochemical migration than, for example, solder paste Sn42Bi58. The highest resistance to corrosion has a conductive adhesive CRM-1033B with an Ag content of 75%. Resistance and voltage during the water drop test. From the measured values, it was determined that the values of resistance and voltage decrease with dendrite growing. X-ray spectroscopy was also performed to determine the chemical elemental composition of dendrites. It was found that the dominant element of the dendrite of solder pastes was Sn. In the case of electrically conductive adhesives, Ag was the main element of the dendrite.

Název v anglickém jazyce

Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

Popis výsledku anglicky

In this article, the electrochemical migration of lead-free solders and electrically conductive adhesives with an Ag content of more than 70% was studied by using a water drop test in NaCl solution. The results of solder pastes were compared with the results of electrically conductive adhesives. It was found that some solder pastes with a low Ag content have a lower susceptibility to electrochemical migration than, for example, solder paste Sn42Bi58. The highest resistance to corrosion has a conductive adhesive CRM-1033B with an Ag content of 75%. Resistance and voltage during the water drop test. From the measured values, it was determined that the values of resistance and voltage decrease with dendrite growing. X-ray spectroscopy was also performed to determine the chemical elemental composition of dendrites. It was found that the dominant element of the dendrite of solder pastes was Sn. In the case of electrically conductive adhesives, Ag was the main element of the dendrite.

Druh

J_ost - Ostatní články v recenzovaných periodicích

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

ElectroScope

ISSN

1802-4564

e-ISSN

1802-4564

Svazek periodika

2019

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

CZ - Česká republika

Počet stran výsledku

5

Strana od-do

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Kód UT WoS článku

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EID výsledku v databázi Scopus

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