Dendritic Growth at Constant Voltage Between Electrodes Coated by SnBiAg, SAC, SnCu and SnPb Solder

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00343933" target="_blank" >RIV/68407700:21230/20:00343933 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE49702.2020.9121013" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121013</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121013" target="_blank" >10.1109/ISSE49702.2020.9121013</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Dendritic Growth at Constant Voltage Between Electrodes Coated by SnBiAg, SAC, SnCu and SnPb Solder

Popis výsledku v původním jazyce

In this work, dendritic growth between electrodes coated by Sn42Bi57Ag1, SAC 305, Sn99.3Cu0.7 and Sn63Pb37 Solder was studied. The water drop test method with a 0.02permille concentration of NaCl dissolved in the deionized and purified water was used to support the growth of dendrites on the samples corresponding to the IPC-B-24 standard . The dendritic growth was induced under the constant low voltage DC bias (1.5V) between the electrodes and the results between different alloys were compared. The solder alloys electro-chemical migration resistance was compared with respect to their Tin content, however the low temperature solder paste with 42wt% tin content showed similar results as the solder alloy with 99.3wt% of Tin. The change of surface insulation resistance (SIR) in time during the dendritic growth was observed. The dendrites were subjected to an EDX analysis on the electron microscope and the fern dendrite structure material analysis was conducted.

Název v anglickém jazyce

Dendritic Growth at Constant Voltage Between Electrodes Coated by SnBiAg, SAC, SnCu and SnPb Solder

Popis výsledku anglicky

In this work, dendritic growth between electrodes coated by Sn42Bi57Ag1, SAC 305, Sn99.3Cu0.7 and Sn63Pb37 Solder was studied. The water drop test method with a 0.02permille concentration of NaCl dissolved in the deionized and purified water was used to support the growth of dendrites on the samples corresponding to the IPC-B-24 standard . The dendritic growth was induced under the constant low voltage DC bias (1.5V) between the electrodes and the results between different alloys were compared. The solder alloys electro-chemical migration resistance was compared with respect to their Tin content, however the low temperature solder paste with 42wt% tin content showed similar results as the solder alloy with 99.3wt% of Tin. The change of surface insulation resistance (SIR) in time during the dendritic growth was observed. The dendrites were subjected to an EDX analysis on the electron microscope and the fern dendrite structure material analysis was conducted.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Demanovska Valley

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000610543500041