Dendritic Growth and its Dependence on Various Conditions

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Dendritic Growth and its Dependence on Various Conditions

Popis výsledku v původním jazyce

Printed circuit board (PCB) as a basic supporting structure of electronic devices is a significant reliability factor in electronic manufacturing. The miniaturization in electronics leads to lower gaps between pads with different electrical potential and that increases the probability of fault caused by dendritic growth. Not just the ambient environment has influence on electrochemical migration, but the surface finish, the solder mask, used solder and the cleaning process influences the dendritic growth and its composition and thus the reliability of PCBs and the final product. The results indicate, that the use of suitable soldering mask without any doubt hinders, though not fully the dendritic growth. An unexpected result is that the dendritic growth was also hindered when the flux residues were present. The lowest resistance against dendritic growth was discovered with organic solderability preservatives (OSP) surface finish, the highest with electroless nickel immersion gold (ENIG). The element analysis showed that the dendrites do not grow directly from the soldering pads. The surface finish therefore does not have a direct influence on dendrites, but rather on the chemical compound that is formed between the surface finish and the solder. These compounds are then prone to electrochemical migration.

Název v anglickém jazyce

Dendritic Growth and its Dependence on Various Conditions

Popis výsledku anglicky

Printed circuit board (PCB) as a basic supporting structure of electronic devices is a significant reliability factor in electronic manufacturing. The miniaturization in electronics leads to lower gaps between pads with different electrical potential and that increases the probability of fault caused by dendritic growth. Not just the ambient environment has influence on electrochemical migration, but the surface finish, the solder mask, used solder and the cleaning process influences the dendritic growth and its composition and thus the reliability of PCBs and the final product. The results indicate, that the use of suitable soldering mask without any doubt hinders, though not fully the dendritic growth. An unexpected result is that the dendritic growth was also hindered when the flux residues were present. The lowest resistance against dendritic growth was discovered with organic solderability preservatives (OSP) surface finish, the highest with electroless nickel immersion gold (ENIG). The element analysis showed that the dendrites do not grow directly from the soldering pads. The surface finish therefore does not have a direct influence on dendrites, but rather on the chemical compound that is formed between the surface finish and the solder. These compounds are then prone to electrochemical migration.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2018 41st International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-3-319-73847-5

ISSN

2161-2536

e-ISSN

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Počet stran výsledku

5

Strana od-do

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Název nakladatele

IEEE

Místo vydání

NEW YORK, NY

Místo konání akce

Zlatibor, Serbia

Datum konání akce

16. 5. 2018

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000449866600028