3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00377341" target="_blank" >RIV/68407700:21230/24:00377341 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE61612.2024.10603755" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10603755</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10603755" target="_blank" >10.1109/ISSE61612.2024.10603755</a>

Jazyk výsledku

angličtina

Název v původním jazyce

3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties

Popis výsledku v původním jazyce

The aim of this work is to advance the development of an alternative eco-friendly method of manufacturing printed circuit boards (PCBs) using recycled and recyclable 3D printable polymers as the insulating substrate and a special silver paste for the conductive pattern. The components are embedded in the insulating substrate, and the connection to the PCB is made by overprinting the component with the silver paste. To improve mechanical properties and durability, in this work, the conductive pattern was overprinted on the 3D printer with another layer of recycled polymer, completely encapsulating the component. The results showed that the overprinting post-process led to a significant improvement in the mechanical properties of the interconnects with no negative impacts on the contact resistance of the components. The measurements of contact resistance indicated similarity to ECA joints. According to the pull-off test performed on the assembled two-terminal components, the pull-off force required to detach the component was similar to that of the soldered joints. Although the encapsulation did not apparently affect the change of the mechanical and electrical properties after accelerated aging tests, it showed an increase in reliability for rPLA samples. In this case, the encapsulation eliminated cracks in the conductive pattern. Despite the extensive development that still lies ahead, this alternative, environmentally friendly method could then be used in low-cost electronics or prototyping applications where sustainability is a priority.

Název v anglickém jazyce

3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties

Popis výsledku anglicky

The aim of this work is to advance the development of an alternative eco-friendly method of manufacturing printed circuit boards (PCBs) using recycled and recyclable 3D printable polymers as the insulating substrate and a special silver paste for the conductive pattern. The components are embedded in the insulating substrate, and the connection to the PCB is made by overprinting the component with the silver paste. To improve mechanical properties and durability, in this work, the conductive pattern was overprinted on the 3D printer with another layer of recycled polymer, completely encapsulating the component. The results showed that the overprinting post-process led to a significant improvement in the mechanical properties of the interconnects with no negative impacts on the contact resistance of the components. The measurements of contact resistance indicated similarity to ECA joints. According to the pull-off test performed on the assembled two-terminal components, the pull-off force required to detach the component was similar to that of the soldered joints. Although the encapsulation did not apparently affect the change of the mechanical and electrical properties after accelerated aging tests, it showed an increase in reliability for rPLA samples. In this case, the encapsulation eliminated cracks in the conductive pattern. Despite the extensive development that still lies ahead, this alternative, environmentally friendly method could then be used in low-cost electronics or prototyping applications where sustainability is a priority.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 47th International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3503-8548-9

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Praha

Datum konání akce

15. 5. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001283808200032