Influence of Stencil Thickness and Surface Finishes of Soldering Pads on the Formation of the Voids Inside Solder Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00386744" target="_blank" >RIV/68407700:21230/25:00386744 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE65583.2025.11120946" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11120946</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120946" target="_blank" >10.1109/ISSE65583.2025.11120946</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Stencil Thickness and Surface Finishes of Soldering Pads on the Formation of the Voids Inside Solder Joints

Popis výsledku v původním jazyce

This article focuses on the formation of the voids inside the solder joints during reflow soldering in surface mount technology (SMT). The stencil printing technology is commonly used during SMT for the solder paste deposition on the printed circuit boards (PCBs) respectively on the soldering pads. The stencil can have different thicknesses according to the requests. The thicknesses 100, 150 and 200 μm were chosen for the study of the stencil thickness influence on the voids formation inside the solder joints. The results showed that the number of macrovoids is lowest for the thickest stencil; on the other hand, the surface area of the macrovoids is highest for the thickest stencil. Additionally, we used three different surface finishes (organic surface preservative - OSP, hot air solder levelling HASL and electroless nickel immersion gold - ENIG) of soldering pads in the experiment to study the influence of surface finishes on the voids formation. When the lowest voids formation was observed in the case of HASL surface finish and highest in the OSP.

Název v anglickém jazyce

Influence of Stencil Thickness and Surface Finishes of Soldering Pads on the Formation of the Voids Inside Solder Joints

Popis výsledku anglicky

This article focuses on the formation of the voids inside the solder joints during reflow soldering in surface mount technology (SMT). The stencil printing technology is commonly used during SMT for the solder paste deposition on the printed circuit boards (PCBs) respectively on the soldering pads. The stencil can have different thicknesses according to the requests. The thicknesses 100, 150 and 200 μm were chosen for the study of the stencil thickness influence on the voids formation inside the solder joints. The results showed that the number of macrovoids is lowest for the thickest stencil; on the other hand, the surface area of the macrovoids is highest for the thickest stencil. Additionally, we used three different surface finishes (organic surface preservative - OSP, hot air solder levelling HASL and electroless nickel immersion gold - ENIG) of soldering pads in the experiment to study the influence of surface finishes on the voids formation. When the lowest voids formation was observed in the case of HASL surface finish and highest in the OSP.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2025 International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3315-1217-0

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Budapešť

Datum konání akce

14. 5. 2025

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001585293500028