Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00386746" target="_blank" >RIV/68407700:21230/25:00386746 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE65583.2025.11121063" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121063</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121063" target="_blank" >10.1109/ISSE65583.2025.11121063</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105

Popis výsledku v původním jazyce

This study investigates the electrochemical migration (ECM) behavior of novel SAC105-based solder alloys with varying Fe and Bi contents (0.05 Fe 2 Bi, 0.1 Fe 2 Bi, 0.1 Fe 1 Bi) in comparison to SAC105 without additives. The evaluation was conducted using a water drop test with a 1 mM NaCl electrolyte under an applied voltage of 3 V to determine the time to failure (TTF). Electrode surface, dendrite formations, and precipitates were characterized through scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The ECM behaviors were then compared to the corrosion properties determined using a polarization test. The results indicate that the SAC105 alloy without additives exhibited the shortest TTF, and the incorporation of Fe and Bi additives enhanced ECM resistance, with the 0.1 Fe 1 Bi alloy demonstrating the highest TTF. However, EDX analysis reveals that there is no iron or bismuth in the dendrites; only tin was observed to deposit at the cathode. The polarization test revealed an opposite outcome, as the 0.1 Fe 1 Bi alloy showed the lowest corrosion resistance. The findings underscore the necessity to contemplate both mechanisms in order to ensure the reliability of solder alloys.

Název v anglickém jazyce

Effect of Fe and Bi Additives on Electrochemical Migration Behavior of SAC105

Popis výsledku anglicky

This study investigates the electrochemical migration (ECM) behavior of novel SAC105-based solder alloys with varying Fe and Bi contents (0.05 Fe 2 Bi, 0.1 Fe 2 Bi, 0.1 Fe 1 Bi) in comparison to SAC105 without additives. The evaluation was conducted using a water drop test with a 1 mM NaCl electrolyte under an applied voltage of 3 V to determine the time to failure (TTF). Electrode surface, dendrite formations, and precipitates were characterized through scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), and X-ray diffraction (XRD). The ECM behaviors were then compared to the corrosion properties determined using a polarization test. The results indicate that the SAC105 alloy without additives exhibited the shortest TTF, and the incorporation of Fe and Bi additives enhanced ECM resistance, with the 0.1 Fe 1 Bi alloy demonstrating the highest TTF. However, EDX analysis reveals that there is no iron or bismuth in the dendrites; only tin was observed to deposit at the cathode. The polarization test revealed an opposite outcome, as the 0.1 Fe 1 Bi alloy showed the lowest corrosion resistance. The findings underscore the necessity to contemplate both mechanisms in order to ensure the reliability of solder alloys.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2025 International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3315-1217-0

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Budapešť

Datum konání akce

14. 5. 2025

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001585293500094