Electrochemical Migration Resistance of Gold Surface Finishes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376643" target="_blank" >RIV/68407700:21230/24:00376643 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE61612.2024.10604108" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604108</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604108" target="_blank" >10.1109/ISSE61612.2024.10604108</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Electrochemical Migration Resistance of Gold Surface Finishes

Popis výsledku v původním jazyce

So far, only a few studies have been focused on the electrochemical migration (ECM) of gold or gold surface finishes of printed circuit boards. Therefore, this work focused on the evaluation and comparison of electroless nickel immersion gold (ENIG) and galvanic gold in terms of ECM. The copper surface was also included in the experiment as a reference value. The water drop test (WDT) was conducted with distilled water on the comb pattern electrodes with three different applied voltages, and time to failure (TTF) was measured. Energy Dispersive X-ray (EDX) analysis of the dendrites was subsequently performed regarding their composition. The results showed an apparent difference in ECM behavior between the gold surface finishes. ENIG surface finish is more resistant to ECM than galvanic gold. Bare copper is the most susceptible to ECM among tested surface finishes. The difference in susceptibility to ECM among gold surface finishes is caused by their structure and how they cover the copper electrodes.

Název v anglickém jazyce

Electrochemical Migration Resistance of Gold Surface Finishes

Popis výsledku anglicky

So far, only a few studies have been focused on the electrochemical migration (ECM) of gold or gold surface finishes of printed circuit boards. Therefore, this work focused on the evaluation and comparison of electroless nickel immersion gold (ENIG) and galvanic gold in terms of ECM. The copper surface was also included in the experiment as a reference value. The water drop test (WDT) was conducted with distilled water on the comb pattern electrodes with three different applied voltages, and time to failure (TTF) was measured. Energy Dispersive X-ray (EDX) analysis of the dendrites was subsequently performed regarding their composition. The results showed an apparent difference in ECM behavior between the gold surface finishes. ENIG surface finish is more resistant to ECM than galvanic gold. Bare copper is the most susceptible to ECM among tested surface finishes. The difference in susceptibility to ECM among gold surface finishes is caused by their structure and how they cover the copper electrodes.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 47th International Spring Seminar on Electronics Technology (ISSE)

ISBN

979-8-3503-8548-9

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Praha

Datum konání akce

15. 5. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001283808200068