Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21670%2F11%3A00187730" target="_blank" >RIV/68407700:21670/11:00187730 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.nima.2010.04.083" target="_blank" >http://dx.doi.org/10.1016/j.nima.2010.04.083</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.nima.2010.04.083" target="_blank" >10.1016/j.nima.2010.04.083</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

Popis výsledku v původním jazyce

A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the long pixel side, this resulting in a p-n inter-electrode distance of . Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014.

Název v anglickém jazyce

Tracking efficiency and charge sharing of 3D silicon sensors at different angles in a 1.4 T magnetic field

Popis výsledku anglicky

A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the long pixel side, this resulting in a p-n inter-electrode distance of . Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15° angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BG - Jaderná, atomová a molekulová fyzika, urychlovače

OECD FORD obor

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Projekt

<a href="/cs/project/LA08015" target="_blank" >LA08015: Spolupráce ČR s CERN</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Nuclear Instruments and Methods in Physics Research, Section A, Accelerators, Spectrometers, Detectors and Associated Equipment

ISSN

0168-9002

e-ISSN

—

Svazek periodika

636

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

8

Strana od-do

42-49

Kód UT WoS článku

000291416400008

EID výsledku v databázi Scopus

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