MASS ANALYSIS OF THE COMPONENTS SEPARATED FROM PRINTED CIRCUIT BOARDS

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F09%3A63507801" target="_blank" >RIV/70883521:28140/09:63507801 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Jazyk výsledku
angličtina
Název v původním jazyce
MASS ANALYSIS OF THE COMPONENTS SEPARATED FROM PRINTED CIRCUIT BOARDS
Popis výsledku v původním jazyce
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For this purpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulated mathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plastic elements. We present the obtained results in this paper.
Název v anglickém jazyce
MASS ANALYSIS OF THE COMPONENTS SEPARATED FROM PRINTED CIRCUIT BOARDS
Popis výsledku anglicky
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For this purpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulated mathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plastic elements. We present the obtained results in this paper.

Rok uplatnění
2009
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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