Let us be Prepared in Defence Against Counterfeit Integrated Circuits.

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F16%3A43875050" target="_blank" >RIV/70883521:28140/16:43875050 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/70883521:28110/16:43875050

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Let us be Prepared in Defence Against Counterfeit Integrated Circuits.

Popis výsledku v původním jazyce

This paper deals with an important topic aimed at counterfeit electronic components and their detection. The preventive technical diagnostics methods for counterfeit components revealing before entering the assembly process are mentioned and described. There are discussed both nowadays common analytical methods and also methods containing counterfeit components revealing potential to be evaluated and applied. Some facts which may influence negatively the component evaluation result are also mentioned. Practical methods for semiconductor component genuineness evaluation are discussed and illustrated with examples based on our research activities in relation to cooperation with electronic devices assembly manufacturers. Those methods correspond with our current research laboratory equipment comprising analogue signature analyzer, electronic component oriented X-ray, fiber laser for component package decapsulation, scanning electron microscopy, confocal microscopy, polarization microscopy, Raman spectroscopy and Terahertz spectroscopy. The model case of counterfeit component discovery among spare parts and replaced parts in a company repairing measurement devices is given in the end of this paper.

Název v anglickém jazyce

Let us be Prepared in Defence Against Counterfeit Integrated Circuits.

Popis výsledku anglicky

This paper deals with an important topic aimed at counterfeit electronic components and their detection. The preventive technical diagnostics methods for counterfeit components revealing before entering the assembly process are mentioned and described. There are discussed both nowadays common analytical methods and also methods containing counterfeit components revealing potential to be evaluated and applied. Some facts which may influence negatively the component evaluation result are also mentioned. Practical methods for semiconductor component genuineness evaluation are discussed and illustrated with examples based on our research activities in relation to cooperation with electronic devices assembly manufacturers. Those methods correspond with our current research laboratory equipment comprising analogue signature analyzer, electronic component oriented X-ray, fiber laser for component package decapsulation, scanning electron microscopy, confocal microscopy, polarization microscopy, Raman spectroscopy and Terahertz spectroscopy. The model case of counterfeit component discovery among spare parts and replaced parts in a company repairing measurement devices is given in the end of this paper.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/LO1303" target="_blank" >LO1303: Podpora udržitelnosti a rozvoje Centra bezpečnostních, informačních a pokročilých technologií (CEBIA-Tech)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

WSEAS Transactions on Electronics

ISSN

1109-9445

e-ISSN

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Svazek periodika

Vol 7

Číslo periodika v rámci svazku

8

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

17

Strana od-do

48-64

Kód UT WoS článku

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EID výsledku v databázi Scopus

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