Analysis of capacitive touchscreen electrodes design patterns from an EMI/EMS perspective

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F25%3A63600278" target="_blank" >RIV/70883521:28140/25:63600278 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/11170267" target="_blank" >https://ieeexplore.ieee.org/document/11170267</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/EMCSIPI52291.2025.11170267" target="_blank" >10.1109/EMCSIPI52291.2025.11170267</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Analysis of capacitive touchscreen electrodes design patterns from an EMI/EMS perspective

Popis výsledku v původním jazyce

Capacitive touch sensing has gained traction in modern human-machine interfaces (HMIs) due to its cost efficiency, versatility, and reliability. In parallel, the proliferation of high-speed wireless systems has spurred interest in integrating high-frequency antennas within touch screen panels (TSPs). As device dimensions continue to expand, particularly in large-screen applications, addressing challenges arising from the touch-sensing circuitry and TSP design is crucial, particularly in electromagnetic interference (EMI) and electromagnetic susceptibility (EMS). This research primarily focuses on the simulation and experimental study of various commonly used capacitive touchscreen patterns and the analysis of how these configurations influence signal coupling between touch electrodes and the surrounding environment. The results show that larger screens with complex touch electrode patterns exhibit an increased propensity to couple with undesired signals across different frequencies. While TSPs with simpler electrode design patterns can partially mitigate these effects, they might introduce additional challenges, such as higher parasitic capacitances and increased loading on the drive circuitry. However, designing TSPs with intrinsically higher immunity to EMS and lower emissions while keeping the signal-to-noise ratio (SNR) within tolerance remains vital for touch-based HMI deployment for critical systems in noise-prone environments, such as electric automotive systems.

Název v anglickém jazyce

Analysis of capacitive touchscreen electrodes design patterns from an EMI/EMS perspective

Popis výsledku anglicky

Capacitive touch sensing has gained traction in modern human-machine interfaces (HMIs) due to its cost efficiency, versatility, and reliability. In parallel, the proliferation of high-speed wireless systems has spurred interest in integrating high-frequency antennas within touch screen panels (TSPs). As device dimensions continue to expand, particularly in large-screen applications, addressing challenges arising from the touch-sensing circuitry and TSP design is crucial, particularly in electromagnetic interference (EMI) and electromagnetic susceptibility (EMS). This research primarily focuses on the simulation and experimental study of various commonly used capacitive touchscreen patterns and the analysis of how these configurations influence signal coupling between touch electrodes and the surrounding environment. The results show that larger screens with complex touch electrode patterns exhibit an increased propensity to couple with undesired signals across different frequencies. While TSPs with simpler electrode design patterns can partially mitigate these effects, they might introduce additional challenges, such as higher parasitic capacitances and increased loading on the drive circuitry. However, designing TSPs with intrinsically higher immunity to EMS and lower emissions while keeping the signal-to-noise ratio (SNR) within tolerance remains vital for touch-based HMI deployment for critical systems in noise-prone environments, such as electric automotive systems.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

IEEE International Symposium on Electromagnetic Compatibility

ISBN

979-8-3315-0875-3

ISSN

2158-110X

e-ISSN

2158-1118

Počet stran výsledku

6

Strana od-do

523-528

Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Raleigh

Datum konání akce

18. 8. 2025

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001692753900122