Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F11%3A10108205" target="_blank" >RIV/00216208:11320/11:10108205 - isvavai.cz</a>
Nalezeny alternativní kódy
RIV/68378271:_____/11:00373839
Výsledek na webu
<a href="http://dx.doi.org/10.1140/epjd/e2011-20393-7" target="_blank" >http://dx.doi.org/10.1140/epjd/e2011-20393-7</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1140/epjd/e2011-20393-7" target="_blank" >10.1140/epjd/e2011-20393-7</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
Popis výsledku v původním jazyce
Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incomingparticles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). Properties and crystallography of Ti-Cu films are discussed as a function of ion energy which is affected by the mode of sputtering. It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about similar to 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (similar to 5 mu A/cm(2)) and is mostly represented by Cu(+) and Ar(+) ions. The mode of sputtering influences chemic
Název v anglickém jazyce
Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
Popis výsledku anglicky
Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incomingparticles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). Properties and crystallography of Ti-Cu films are discussed as a function of ion energy which is affected by the mode of sputtering. It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about similar to 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (similar to 5 mu A/cm(2)) and is mostly represented by Cu(+) and Ar(+) ions. The mode of sputtering influences chemic
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
BL - Fyzika plasmatu a výboje v plynech
OECD FORD obor
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Návaznosti výsledku
Projekt
Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2011
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
European Physical Journal D
ISSN
1434-6060
e-ISSN
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Svazek periodika
64
Číslo periodika v rámci svazku
2
Stát vydavatele periodika
DE - Spolková republika Německo
Počet stran výsledku
9
Strana od-do
427-435
Kód UT WoS článku
000296630800029
EID výsledku v databázi Scopus
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