Harmonic analysis of discharge voltages as a tool to control the RF sputtering deposition process

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00029226" target="_blank" >RIV/00216224:14310/09:00029226 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Harmonic analysis of discharge voltages as a tool to control the RF sputtering deposition process

Popis výsledku v původním jazyce

The reactive magnetron sputtering deposition process controlled by the flow of the reactive gas exhibits processing stability problems. Since the optimal experimental conditions lie very close to the abrupt transition from the metallic to the compound mode, the range at which the films with the right stoichiometry are deposited at high deposition rates is strongly limited and permanent process monitoring is necessary. A sensitive method for the process monitoring is proposed which is based on the measurement of amplitudes of fundamental or higher harmonic frequencies of discharge voltages during the radio-frequency sputtering deposition process. The voltage waveform recorded by the uncompensated probe placed in the vicinity of the plasma contains muchhigher relative proportion of higher harmonics than the waveform measured on the cathode. Some of the harmonics are extremely sensitive markers of the transition between the two regimes of interest.

Název v anglickém jazyce

Harmonic analysis of discharge voltages as a tool to control the RF sputtering deposition process

Popis výsledku anglicky

The reactive magnetron sputtering deposition process controlled by the flow of the reactive gas exhibits processing stability problems. Since the optimal experimental conditions lie very close to the abrupt transition from the metallic to the compound mode, the range at which the films with the right stoichiometry are deposited at high deposition rates is strongly limited and permanent process monitoring is necessary. A sensitive method for the process monitoring is proposed which is based on the measurement of amplitudes of fundamental or higher harmonic frequencies of discharge voltages during the radio-frequency sputtering deposition process. The voltage waveform recorded by the uncompensated probe placed in the vicinity of the plasma contains muchhigher relative proportion of higher harmonics than the waveform measured on the cathode. Some of the harmonics are extremely sensitive markers of the transition between the two regimes of interest.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BL - Fyzika plasmatu a výboje v plynech

OECD FORD obor

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Projekt

<a href="/cs/project/GP202%2F08%2FP038" target="_blank" >GP202/08/P038: Studium chování hybridního depozičního procesu a jeho využití pro přípravu tenkých vrstev</a><br>

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Europhysics Letters

ISSN

0295-5075

e-ISSN

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Svazek periodika

85

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

FR - Francouzská republika

Počet stran výsledku

5

Strana od-do

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Kód UT WoS článku

000263692500019

EID výsledku v databázi Scopus

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