MSM realized by Thick Film Technology

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU29215" target="_blank" >RIV/00216305:26220/02:PU29215 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Jazyk výsledku
angličtina
Název v původním jazyce
MSM realized by Thick Film Technology
Popis výsledku v původním jazyce
Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package soluttions technologies. To describe and discuss some of the possible ways is the aim of this article.
Název v anglickém jazyce
MSM realized by Thick Film Technology
Popis výsledku anglicky
Multi Substrate Modules (MSM) are constructed as the stacked packages. One of themost significant advances is high flexibility and possibility to build a cheap electronic system. They give a good ooportunity to construct high volume three-dimensional devices with requested quality. 3D packages deliver volumetric density through vertical stacking. This method integrates multiple substrates and chips in a package to provide higher levels of functionality than can be achieved through multiple package soluttions technologies. To describe and discuss some of the possible ways is the aim of this article.

Rok uplatnění
2002
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Podobné výsledky(10)