On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU93661" target="_blank" >RIV/00216305:26220/11:PU93661 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560" target="_blank" >http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Popis výsledku v původním jazyce

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

Název v anglickém jazyce

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Popis výsledku anglicky

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2011 - PROCEEDINGS

ISBN

978-1-4577-2111-3

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

3

Strana od-do

109-111

Název nakladatele

Technická Univerzita Košice

Místo vydání

Košice, SK

Místo konání akce

Tatranská Lomnica

Datum konání akce

11. 5. 2011

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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