Contribution to realization of 3D structures

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU87237" target="_blank" >RIV/00216305:26220/10:PU87237 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Jazyk výsledku
angličtina
Název v původním jazyce
Contribution to realization of 3D structures
Popis výsledku v původním jazyce
This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized intwo ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).
Název v anglickém jazyce
Contribution to realization of 3D structures
Popis výsledku anglicky
This paper describes design, construction and some recent test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates. These various substrate configurations are realized intwo ways, at first by lead-free solder bumps made by solder paste stencil printing, and at second by bumps using combination of paste and solder balls. This three dimensional technology offers great potential to very compact embedded structures which may include as hybrid integrated circuits (HIC) well as non-conventional applications (sensors, attenuators etc).

Projekt
Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.
Návaznosti
Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění
2010
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Podobné výsledky(10)