Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU105873" target="_blank" >RIV/00216305:26220/13:PU105873 - isvavai.cz</a>
Výsledek na webu
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648228" target="_blank" >http://dx.doi.org/10.1109/ISSE.2013.6648228</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648228" target="_blank" >10.1109/ISSE.2013.6648228</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
Popis výsledku v původním jazyce
The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and astructure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.
Název v anglickém jazyce
Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate
Popis výsledku anglicky
The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and astructure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2013
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics
ISSN
2161-2528
e-ISSN
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Svazek periodika
36
Číslo periodika v rámci svazku
2013
Stát vydavatele periodika
SK - Slovenská republika
Počet stran výsledku
5
Strana od-do
127-131
Kód UT WoS článku
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EID výsledku v databázi Scopus
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