RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Popis výsledku v původním jazyce

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYSand the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimentalmeasurements and these are compared and analyzed.

Název v anglickém jazyce

RELIABILITY OF SOLDERED CONNECTION FR-4 AND LTCC VIA SMD

Popis výsledku anglicky

This article deals with the area of solder joints reliability and narrower focus is on interconnetion between FR-4 and low temperature co-fired substrate LTCC via smd part. The text describes the introduction to the issue of reliability of soldered connections and important factors with their influences. These factors also relate with choice of substrates and technological processes of preparation, which are characterized and described. Another part is devoted to the sphere of computer analysis in ANSYSand the specifically. Then are included some options for analysis of reliability. It contains the issue of fatigue models and design of simulation in ANSYS. In conclusion, there are described otuputs of simulations and results obtained from experimentalmeasurements and these are compared and analyzed.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Nanocon 2015 Conference proceedings

ISBN

978-80-87294-59-8

ISSN

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e-ISSN

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Počet stran výsledku

9

Strana od-do

1-1

Název nakladatele

Tanger, Ltd.

Místo vydání

Ostrava

Místo konání akce

Brno

Datum konání akce

15. 10. 2015

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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