The Analysis of Ceramic Resistor Arrays in SMT

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

The Analysis of Ceramic Resistor Arrays in SMT

Popis výsledku v původním jazyce

This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.

Název v anglickém jazyce

The Analysis of Ceramic Resistor Arrays in SMT

Popis výsledku anglicky

This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 23rd Conference STUDENT EEICT 2017

ISBN

978-80-214-5496-5

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

550-554

Název nakladatele

Neuveden

Místo vydání

Neuveden

Místo konání akce

Brno

Datum konání akce

27. 4. 2017

Typ akce podle státní příslušnosti

CST - Celostátní akce

Kód UT WoS článku

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