The Analysis of Solder Preforms in Surface Mount Assembly

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

The Analysis of Solder Preforms in Surface Mount Assembly

Popis výsledku v původním jazyce

This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.

Název v anglickém jazyce

The Analysis of Solder Preforms in Surface Mount Assembly

Popis výsledku anglicky

This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 22nd Conference STUDENT EEICT 2016

ISBN

978-80-214-5350-0

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

685-689

Název nakladatele

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo vydání

Neuveden

Místo konání akce

Brno

Datum konání akce

28. 4. 2016

Typ akce podle státní příslušnosti

CST - Celostátní akce

Kód UT WoS článku

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