A new approach to measuring the temperature fields in reflow ovens

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F26%3A0197663" target="_blank" >RIV/00216305:26220/26:0197663 - isvavai.cz</a>

Výsledek na webu

<a href="https://sciendo.com/article/10.2478/jee-2025-0019" target="_blank" >https://sciendo.com/article/10.2478/jee-2025-0019</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.2478/jee-2025-0019" target="_blank" >10.2478/jee-2025-0019</a>

Jazyk výsledku

angličtina

Název v původním jazyce

A new approach to measuring the temperature fields in reflow ovens

Popis výsledku v původním jazyce

Electronics play an increasingly significant role in our lives. Consequently, the demand for both production volume and quality in electronics is continuously rising. Conveyor reflow ovens are the most widely used technology for soldering electronic assemblies onto printed circuit boards. The implementation of these ovens directly affects the quality of solder joints and, most importantly, the reliability of manufactured electronic assemblies, which are present in virtually all aspects of daily life. The solder joint is formed by the reflow of the solder alloy and is defined by the thermal profile, which represents temperature over time. The most common heating method relies on forced hot air convection, where the printed circuit board with mounted components moves through the oven. One of the key design requirements for these ovens is maintaining a consistent thermal profile to achieve a homogeneous temperature field across the reflow zones. To assess this condition, it is essential to measure convection under operating conditions. A new method for measuring the temperature field directly within the conveyor oven has been developed and experimentally verified during production.

Název v anglickém jazyce

A new approach to measuring the temperature fields in reflow ovens

Popis výsledku anglicky

Electronics play an increasingly significant role in our lives. Consequently, the demand for both production volume and quality in electronics is continuously rising. Conveyor reflow ovens are the most widely used technology for soldering electronic assemblies onto printed circuit boards. The implementation of these ovens directly affects the quality of solder joints and, most importantly, the reliability of manufactured electronic assemblies, which are present in virtually all aspects of daily life. The solder joint is formed by the reflow of the solder alloy and is defined by the thermal profile, which represents temperature over time. The most common heating method relies on forced hot air convection, where the printed circuit board with mounted components moves through the oven. One of the key design requirements for these ovens is maintaining a consistent thermal profile to achieve a homogeneous temperature field across the reflow zones. To assess this condition, it is essential to measure convection under operating conditions. A new method for measuring the temperature field directly within the conveyor oven has been developed and experimentally verified during production.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Electrical Engineering-Elektrotechnicky Casopis

ISSN

1335-3632

e-ISSN

1339-309X

Svazek periodika

76

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

SK - Slovenská republika

Počet stran výsledku

6

Strana od-do

184-189

Kód UT WoS článku

001462867000008

EID výsledku v databázi Scopus

2-s2.0-105003634143