The analysis of SMD resistor arrays soldered by Sn96 Ag3,5 Cu 0,5 and Sn42 Bi57.6 Ag0.4 in surface mount assembly.

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU121779" target="_blank" >RIV/00216305:26220/16:PU121779 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

The analysis of SMD resistor arrays soldered by Sn96 Ag3,5 Cu 0,5 and Sn42 Bi57.6 Ag0.4 in surface mount assembly.

Popis výsledku v původním jazyce

This article deals with the area of solder joints reliability and narrower focus is on using ANSYS simulation software and fatigue models for estimation of reliability of solder joints. The text describes real reliability of SMD resistor arrays 0603 and therefore there are set conditions of thermal cycling in thermal chamber. Results obtained by thermal cycling and measuring are compared with results obtained by computer simulations in ANSYS. The purpose of this comparison is to show the usefulness of computer simulations for this type of application and find out for differences between simulations and real measurements. There are further included two types of solder pastes for comparison and monitoring options in simulation. In the conclusion the outputs of simulations and results of practical measurements are evaluated and described. The reliability of solder joints is an area of electronic manufactory and its importance and significance is increasing due technological process becomes more complex.

Název v anglickém jazyce

The analysis of SMD resistor arrays soldered by Sn96 Ag3,5 Cu 0,5 and Sn42 Bi57.6 Ag0.4 in surface mount assembly.

Popis výsledku anglicky

This article deals with the area of solder joints reliability and narrower focus is on using ANSYS simulation software and fatigue models for estimation of reliability of solder joints. The text describes real reliability of SMD resistor arrays 0603 and therefore there are set conditions of thermal cycling in thermal chamber. Results obtained by thermal cycling and measuring are compared with results obtained by computer simulations in ANSYS. The purpose of this comparison is to show the usefulness of computer simulations for this type of application and find out for differences between simulations and real measurements. There are further included two types of solder pastes for comparison and monitoring options in simulation. In the conclusion the outputs of simulations and results of practical measurements are evaluated and described. The reliability of solder joints is an area of electronic manufactory and its importance and significance is increasing due technological process becomes more complex.

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů