Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU137027" target="_blank" >RIV/00216305:26220/20:PU137027 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9121138" target="_blank" >https://ieeexplore.ieee.org/document/9121138</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121138" target="_blank" >10.1109/ISSE49702.2020.9121138</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

Popis výsledku v původním jazyce

The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.

Název v anglickém jazyce

Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

Popis výsledku anglicky

The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Neuveden

Místo konání akce

Demänovská dolina

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—