Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141662" target="_blank" >RIV/00216305:26220/21:PU141662 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9467519" target="_blank" >https://ieeexplore.ieee.org/document/9467519</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467626" target="_blank" >10.1109/ISSE51996.2021.9467626</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Popis výsledku v původním jazyce

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.

Název v anglickém jazyce

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Popis výsledku anglicky

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-1477-7

ISSN

2161-2536

e-ISSN

—

Počet stran výsledku

4

Strana od-do

1-4

Název nakladatele

IEEE

Místo vydání

neuveden

Místo konání akce

Bautzen

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—