Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F14%3A00000006" target="_blank" >RIV/01733214:_____/14:00000006 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

Popis výsledku v původním jazyce

Cross sections of large Through Silicon Vias (TSV) and solder bumps are often prepared using the Focused Ion Beam (FIB). The high current Xe plasma ion source allows fast and precise target preparation of TSV with small diameter. Solder bumps can be accessed due to the high milling rate too. However, thehigh current milling by plasma FIB causes the worsening ofthe milled surface quality. An optimized FIB scanning stratégy accompanied with the novel rocking stage for the sample tilting during the milling has been developed for the plasma FIB. Whole milling process is observed by the Scanning Electron Microscopy (SEM). Time to prepare a cross section is accelerated and the excellent quality is suitable for subsequent failure analysis. Also important is proper sample cleaving before FIB milling. Using an accurate method to cleave the sample prior to FIB preparation further reduces the overall sample preparation time. The high quality cross sections prepared using this new method are ready not only for SEM but also for EDX and EBSD analysis, either 2D or 3D, when combined with FIB slicing. Broadening the analysis to these techniques increases the obtainable information, allowing the arrangement of materials and their crystalline structure to be studied in a detail.

Název v anglickém jazyce

Advances in FIB-SEM Analysis of TSV and Solder Bumps—Approaching Higher Precision, Throughput, and Comprehensiveness

Popis výsledku anglicky

Cross sections of large Through Silicon Vias (TSV) and solder bumps are often prepared using the Focused Ion Beam (FIB). The high current Xe plasma ion source allows fast and precise target preparation of TSV with small diameter. Solder bumps can be accessed due to the high milling rate too. However, thehigh current milling by plasma FIB causes the worsening ofthe milled surface quality. An optimized FIB scanning stratégy accompanied with the novel rocking stage for the sample tilting during the milling has been developed for the plasma FIB. Whole milling process is observed by the Scanning Electron Microscopy (SEM). Time to prepare a cross section is accelerated and the excellent quality is suitable for subsequent failure analysis. Also important is proper sample cleaving before FIB milling. Using an accurate method to cleave the sample prior to FIB preparation further reduces the overall sample preparation time. The high quality cross sections prepared using this new method are ready not only for SEM but also for EDX and EBSD analysis, either 2D or 3D, when combined with FIB slicing. Broadening the analysis to these techniques increases the obtainable information, allowing the arrangement of materials and their crystalline structure to be studied in a detail.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/TE01020233" target="_blank" >TE01020233: Platforma pokročilých mikroskopických a spektroskopických technik pro nano a mikrotechnologie</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2014

Kód důvěrnosti údajů

C - Předmět řešení projektu podléhá obchodnímu tajemství (§ 504 Občanského zákoníku), ale název projektu, cíle projektu a u ukončeného nebo zastaveného projektu zhodnocení výsledku řešení projektu (údaje P03, P04, P15, P19, P29, PN8) dodané do CEP, jsou upraveny tak, aby byly zveřejnitelné.

Název statě ve sborníku

ISTFA 2014: Proceedings of the 40th International Symposium for Testing and Failure Analysis

ISBN

9781627080743

ISSN

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e-ISSN

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Počet stran výsledku

7

Strana od-do

136-142

Název nakladatele

ASM International

Místo vydání

Houston

Místo konání akce

Houston

Datum konání akce

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Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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