Plasma FIB artefact-free milling using TRUE X sectioning technique

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F01733214%3A_____%2F17%3AN0000002" target="_blank" >RIV/01733214:_____/17:N0000002 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.eu-f-n.org/workshop/programme/" target="_blank" >http://www.eu-f-n.org/workshop/programme/</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Plasma FIB artefact-free milling using TRUE X sectioning technique

Popis výsledku v původním jazyce

The Focused Ion Beam (FIB) and the Scanning Electron Microscopy (SEM) are essential techniques for failure analysis of microelectronic devices or material science. For larger cross sections with dimensions exceeding 100 μm, use of Xe plasma FIB is much more convenient due to FIB milling rate increased approximately by a factor of 50. However, two parameters of the cross-sectioning are crucial – the fast milling rate and the high quality of the surface, with no damage or artefacts. While protection layer deposition and multi-tilt stage bring significantly reduced curtaining effect on the most of samples, there are still some materials which exhibit quite poor cross-section quality due to the effect of FIB-induced artefacts (ripples, stairs, terraces). Therefore we propose simple method (TRUE X-sectioning) of the beam shape modification for quality increase of FIB milling on these difficult samples.

Název v anglickém jazyce

Plasma FIB artefact-free milling using TRUE X sectioning technique

Popis výsledku anglicky

The Focused Ion Beam (FIB) and the Scanning Electron Microscopy (SEM) are essential techniques for failure analysis of microelectronic devices or material science. For larger cross sections with dimensions exceeding 100 μm, use of Xe plasma FIB is much more convenient due to FIB milling rate increased approximately by a factor of 50. However, two parameters of the cross-sectioning are crucial – the fast milling rate and the high quality of the surface, with no damage or artefacts. While protection layer deposition and multi-tilt stage bring significantly reduced curtaining effect on the most of samples, there are still some materials which exhibit quite poor cross-section quality due to the effect of FIB-induced artefacts (ripples, stairs, terraces). Therefore we propose simple method (TRUE X-sectioning) of the beam shape modification for quality increase of FIB milling on these difficult samples.

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

21002 - Nano-processes (applications on nano-scale); (biomaterials to be 2.9)

Projekt

<a href="/cs/project/TE01020233" target="_blank" >TE01020233: Platforma pokročilých mikroskopických a spektroskopických technik pro nano a mikrotechnologie</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů